Chip-on-board (COB) LED arrays represent a cost-effective route to deliver performance, colour quality and reliability to an LED based lighting product.
As a designated Cree Solutions Provider, offering an integrated design and manufacturing service, Forge can help lighting OEMs to successfully apply both the ceramic-based CXA/CXB and the metal-based CMA/CMT chip-on-board LED technology; maximising the performance gains available from these exciting product platforms, including the latest XLamp® eTone™ LEDs – offing 90-CRI colour at the same efficacy at today’s 80-CRI LEDs.
|High-Density Integrated Arrays||Small (<14mm LES) Standard- Density Integrated Arrays||Large (>14mm LES) Standard- Density Integrated Arrays|
Chip-on-board (COB) LED arrays have become an established and increasingly adopted method of applying LED technology in a diverse range of lighting applications.
Cree COB LED arrays comprise LED chips that are pre-mounted onto a thermally-efficient substrate and encapsulated beneath a layer of phosphor to create a light-emitting surface (LES). This packaging method, complete with on-board solder pads, makes COB LED arrays deceptively easy to assemble, however, in common with all other LED technology it is important not to overlook the consideration of a wide range of design principles necessary to achieve an efficient, reliable and truly cost effective lighting product, notably:
- Thermal design
- Optical design
- Electrical design
- Mechanical design
To help our customers all of these areas are considered as part of Forge’s service, and we actively welcome enquiries relating to how successfully integrate chip-on-board LED technology in demanding applications.Back to Archive